While polishing silicon wafers for microchip implants in the semiconductor sector, precision abrasives are utilized to achieve polish magnitudes tantamount to mirrors. This is also the case for lenses and mirrors used in components of optics which obtain operators’ expectations of a high degree of radical smoothness. In all the advanced technologies, precision abrasives are required to undergo stringent quality control at every stage of production to ensure that each granule produced is of the desired level of accuracy.